SEMI, Semiconductor Digest Announce Best of West Award Finalists

SEMI and Semiconductor Digest announced finalists for the Best of West award to be presented at SEMICON West 2024, July 9-11 at the Moscone Center in San Francisco. The Best of West Award winner will be announced at SEMICON West 2024 on Thursday, July 11 at 11:00 a.m. PDT.

Presented by SEMI Americas and Semiconductor Digest each year, the Best of West award recognizes innovative new products or services that are significantly advancing the electronics manufacturing supply chain or a particular manufacturing capability.

The following Best of West 2024 finalists will showcase their products on the SEMICON West 2024 show floor:
• Advantest: HA1200 die-level handler – Booth 1039
The new HA1200 die-level handler for the Advantest V93000 system-on-chip (SoC) tester offers die test capability with active thermal control to enable at-speed 100% test coverage before the die are assembled into 2.5D/3D packages, thus ensuring minimal loss of die yield at final test.
• EV Group: EVG 880 LayerRelease – Booth 1345
The EVG 880 LayerRelease system is the first HVM equipment platform incorporating EVG’s innovative LayerRelease technology. It enables nanometer-precision release of bonded, deposited or grown layers from silicon carrier substrates using an IR laser coupled with specially formulated inorganic release materials. As a result, it eliminates the need for glass carriers.
• Nordson TEST & INSPECTION: SpinSAM Acoustic Microscopic Imaging (AMI) System – Booth 1233

The latest product from Nordson TEST & INSPECTION is an automated inspection tool that delivers high throughput and better sensitivity for accurately locating defects in wafer-based assemblies. SpinSAM provides superior image quality and defect capture. Successful applications include bonded wafers, Chip-on-Wafer, stacked wafers, MEMS, over-molded wafers and more.